Video ArchiveChip King – Engineer: Customer Support
Chip describes how the CEQM57 with Intel® Core™ i5 and i7 processors is a great choice for imaging applications requiring high performance and low power consumption.
Lorraine Orcino – Sr. Product Line Manager, COM Express
The full suite of extended temperature, rugged COM Express modules from RadiSys allows you to select the ideal module for your design based on performance, power and temperature requirements.
Based on the new Intel® Mobile Platform, this new module will give your applications the Performance BOOST they've been waiting for!
Rob Dixon , Staff Reliability Engineer
Hear how the RadiSys execution of HALT/HASS testing is both a discovery and exploratory process to ensure long-term reliability and functionality for products deployed in extreme environments.
Learn how collaborating with the COM Experts at RadiSys will help you make the right decisions for your next COM design.
Updated February, 2010! This handy guide makes it easy to choose the perfect module for your next design project.
COM Express 2.0
Read the new White Paper by Bob Pebly, CTO Fellow and active member of PICMG, and learn how the new COM Express 2.0 specification builds on the success of the COM Express 1.0 specification. This new spec brings exciting enhancements such as support for up to three Digital Interfaces, capable of supporting High Definition Multimedia Interface (HDMI), DisplayPort and SDVO interfaces.
COM Express 2.0 – A New Evolution in the COM Express Standard.
Get your free copy of COM Express for Dummies
Learn more about Com Express and request our booklet COM Express for Dummies, compliments of Radisys and Intel.
©2010 RadiSys Corporation